Process monitoring during AlN deposition by reactive magnetron sputtering

J. Acosta, A. Rojo, O. Salas, J. Oseguera

Resultado de la investigación: Contribución a una revistaArtículo

10 Citas (Scopus)

Resumen

The effect of pressure on the reactivity of sputtered Al during reactive magnetron deposition was monitored by optical emission spectroscopy (OES) and a Langmuir probe. The deposition experiments were carried out varying the total pressure from 0.1 Pa to 1.2 Pa in an Ar/N2 7:1 flow ratio gas mixture. The deposited layers were analyzed by scanning electron microscopy (SEM) + energy dispersive analysis (EDS), glancing angle X-ray diffractometry (GAXRD) and X-ray photoelectron spectroscopy (XPS). Analysis of the films formed was based on the process parameters via plasma characterization. A correlation was found between the OES results and the amount of Al deposited. Under the present conditions, the base pressure was found to have a significant effect on the nature of the products deposited.

Idioma originalInglés
Páginas (desde-hasta)7992-7999
Número de páginas8
PublicaciónSurface and Coatings Technology
Volumen201
N.º18
DOI
EstadoPublicada - 25 jun 2007

Huella dactilar

Reactive sputtering
Process monitoring
optical emission spectroscopy
Magnetron sputtering
magnetron sputtering
Optical emission spectroscopy
base pressure
electrostatic probes
gas mixtures
Langmuir probes
x rays
reactivity
photoelectron spectroscopy
Gas mixtures
X ray diffraction analysis
scanning electron microscopy
products
X ray photoelectron spectroscopy
Plasmas
Scanning electron microscopy

Citar esto

Acosta, J. ; Rojo, A. ; Salas, O. ; Oseguera, J. / Process monitoring during AlN deposition by reactive magnetron sputtering. En: Surface and Coatings Technology. 2007 ; Vol. 201, N.º 18. pp. 7992-7999.
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Process monitoring during AlN deposition by reactive magnetron sputtering. / Acosta, J.; Rojo, A.; Salas, O.; Oseguera, J.

En: Surface and Coatings Technology, Vol. 201, N.º 18, 25.06.2007, p. 7992-7999.

Resultado de la investigación: Contribución a una revistaArtículo

TY - JOUR

T1 - Process monitoring during AlN deposition by reactive magnetron sputtering

AU - Acosta, J.

AU - Rojo, A.

AU - Salas, O.

AU - Oseguera, J.

PY - 2007/6/25

Y1 - 2007/6/25

N2 - The effect of pressure on the reactivity of sputtered Al during reactive magnetron deposition was monitored by optical emission spectroscopy (OES) and a Langmuir probe. The deposition experiments were carried out varying the total pressure from 0.1 Pa to 1.2 Pa in an Ar/N2 7:1 flow ratio gas mixture. The deposited layers were analyzed by scanning electron microscopy (SEM) + energy dispersive analysis (EDS), glancing angle X-ray diffractometry (GAXRD) and X-ray photoelectron spectroscopy (XPS). Analysis of the films formed was based on the process parameters via plasma characterization. A correlation was found between the OES results and the amount of Al deposited. Under the present conditions, the base pressure was found to have a significant effect on the nature of the products deposited.

AB - The effect of pressure on the reactivity of sputtered Al during reactive magnetron deposition was monitored by optical emission spectroscopy (OES) and a Langmuir probe. The deposition experiments were carried out varying the total pressure from 0.1 Pa to 1.2 Pa in an Ar/N2 7:1 flow ratio gas mixture. The deposited layers were analyzed by scanning electron microscopy (SEM) + energy dispersive analysis (EDS), glancing angle X-ray diffractometry (GAXRD) and X-ray photoelectron spectroscopy (XPS). Analysis of the films formed was based on the process parameters via plasma characterization. A correlation was found between the OES results and the amount of Al deposited. Under the present conditions, the base pressure was found to have a significant effect on the nature of the products deposited.

KW - AlN

KW - DC magnetron sputtering

KW - Langmuir probe

KW - Optical emission spectroscopy

KW - Plasma monitoring

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U2 - 10.1016/j.surfcoat.2007.03.048

DO - 10.1016/j.surfcoat.2007.03.048

M3 - Artículo

AN - SCOPUS:34249301765

VL - 201

SP - 7992

EP - 7999

JO - Surface and Coatings Technology

JF - Surface and Coatings Technology

SN - 0257-8972

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